The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
May. 13, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Ming-Hui Yang, New Taipei, TW;
Chun-Ting Liao, Hsinchu, TW;
Yi-Te Chen, Hsinchu, TW;
Chen-Yuan Chen, Hsinchu, TW;
Ho-Chun Liou, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 2924/14 (2013.01); H01L 2924/141 (2013.01); H01L 2924/143 (2013.01); H01L 2924/1421 (2013.01);
Abstract
A device includes an outer seal ring, an integrated circuit, and an inner seal ring. The outer seal ring forms a first closed loop. The integrated circuit is surrounded by the outer seal ring. The inner seal ring is between the outer seal ring and the integrated circuit. The inner seal ring forms a second closed loop that defines an enclosed region external to the integrated circuit.