The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Apr. 29, 2020
Applicant:
Yangtze Memory Technologies Co., Ltd., Wuhan, CN;
Inventor:
Jialan He, Wuhan, CN;
Assignee:
YANGTZE MEMORY TECHNOLOGIES CO., LTD., Wuhan, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 23/293 (2013.01); H01L 23/315 (2013.01); H01L 23/3178 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/562 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01);
Abstract
Embodiments of semiconductor chips and fabrication methods thereof are disclosed. In one example, a semiconductor chip includes a main chip region and a protection structure surrounding the main chip region in a plan view. The protection structure includes a dielectric layer and a conductive portion in the dielectric layer. The conductive portion includes a conductive layer and a core having a material different from that of the conductive layer.