The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2023

Filed:

Nov. 20, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Sang-Hoon Shin, Boise, ID (US);

Won Joo Yun, Boise, ID (US);

Rajesh H. Kariya, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/27 (2006.01); G06F 1/00 (2006.01); G06F 13/00 (2006.01); G06F 1/12 (2006.01); G06F 13/20 (2006.01);
U.S. Cl.
CPC ...
G06F 11/27 (2013.01); G06F 1/12 (2013.01); G06F 13/20 (2013.01);
Abstract

Test input/output speed conversion and related apparatuses and methods are disclosed. An apparatus includes a glue circuit and a BIST circuit for core circuitry of an integrated circuit device. The, the BIST circuit includes a test interface, one or more inputs, and one or more outputs. The BIST circuit is configured to operate at a first speed. The glue circuit is configured to interface with the test interface, the one or more inputs, and the one or more outputs of the BIST circuit. The glue circuit is configured to convert between second speed test interface signals and second speed input/output signals operating at a second speed and first speed test interface signals and first speed input/output signals operating at the first speed. The second speed is different from the first speed.


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