The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Dec. 23, 2019
Mitsubishi Materials Corporation, Tokyo, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
This free-cutting copper alloy includes Cu: more than 58.0% and less than 65.0%, Si: more than 0.30% and less than 1.30%, Pb: more than 0.001% and 0.20% or less, Bi: more than 0.020% and 0.10% or less, and P: more than 0.001% and less than 0.20%, with the remainder being Zn and unavoidable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.45%, a total amount of Sn and Al is less than 0.45%, relationships of 56.5≤[Cu]−4.7×[Si]+0.5×[Pb]+0.5×[Bi]−0.5×[P]≤59.5, and 0.025≤[Pb]+[Bi]<0.25 are satisfied, in constituent phases of a metallographic structure, relationships of 20≤(α)<85, 15<(β)≤80, 0≤(γ)<5, 8.0≤([Bi]+[Pb]−0.002)×10+([P]−0.001)×5+((β)−7)×([Si]−0.1)×1.2+(γ)×0.5≤17.0, and 0.9≤([Bi]+[Pb]−0.002)×((β)−7)×([Si]−0.1)≤4.0 are satisfied, and a particle containing Bi is present in α phase.