The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Mar. 26, 2021
Applicant:
Wolfspeed, Inc., Durham, NC (US);
Inventors:
Phil Saint-Erne, Phoenix, AZ (US);
William Pribble, Durham, NC (US);
Warren Brakensiek, Phoenix, AZ (US);
Bradley Millon, Durham, NC (US);
Assignee:
Wolfspeed, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/187 (2006.01); H03F 3/193 (2006.01); H03F 3/195 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H03F 3/213 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H03F 3/193 (2013.01); H01L 23/31 (2013.01); H01L 23/66 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H01L 29/2003 (2013.01);
Abstract
Packaged RF transistor amplifiers are provided that include a flat no-lead overmold package that includes a die pad, a plurality of terminal pads and an overmold encapsulation that at least partially covers the die pad and the terminal pads and an RF transistor amplifier die mounted on the die pad and at least partially covered by the overmold encapsulation. These packaged RF transistor amplifiers may have an output power density of at least 3.0 W/mm.