The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
May. 17, 2021
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Jhih-Bin Chen, Hsinchu, TW;
Ming Chyi Liu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02375 (2021.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01); H01S 5/0237 (2021.01); H01S 5/02325 (2021.01); H01S 5/30 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02375 (2021.01); H01S 5/0237 (2021.01); H01S 5/02325 (2021.01); H01S 5/183 (2013.01); H01S 5/423 (2013.01); H01S 5/3013 (2013.01);
Abstract
Various embodiments of the present disclosure are directed towards a method for forming a vertical cavity surface emitting laser (VCSEL) device. The method includes forming a bond bump and a bond ring over a substrate. A semiconductor die is bonded to the bond ring. A molding layer is formed around the semiconductor die. The molding layer is laterally offset from a cavity between the semiconductor die and the substrate. A VCSEL structure is formed over the bond bump.