The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Jul. 12, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jae-Jung Kim, Suwon-si, KR;

Dong-Soo Lee, Gunpo-si, KR;

Sang-Yong Kim, Suwon-si, KR;

Jin-Kyu Jang, Hwaseong-si, KR;

Won-Keun Chung, Seoul, KR;

Sang-Jin Hyun, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/792 (2006.01); H01L 27/092 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01); H01L 21/8234 (2006.01); H01L 21/8238 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/775 (2006.01); H01L 29/10 (2006.01); B82Y 10/00 (2011.01); H01L 29/786 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7926 (2013.01); B82Y 10/00 (2013.01); H01L 21/28088 (2013.01); H01L 21/82345 (2013.01); H01L 21/823842 (2013.01); H01L 27/088 (2013.01); H01L 27/092 (2013.01); H01L 27/0922 (2013.01); H01L 29/0653 (2013.01); H01L 29/0673 (2013.01); H01L 29/0692 (2013.01); H01L 29/1079 (2013.01); H01L 29/42376 (2013.01); H01L 29/42392 (2013.01); H01L 29/4966 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/775 (2013.01); H01L 29/785 (2013.01); H01L 29/78696 (2013.01); H01L 21/823462 (2013.01); H01L 21/823857 (2013.01);
Abstract

A semiconductor device includes a first transistor having a first threshold voltage, and including first channels, first source/drain layers connected to opposite sidewalls of the first channels, and a first gate structure surrounding the first channels and including a first gate insulation pattern, a first threshold voltage control pattern, and a first workfunction metal pattern sequentially stacked. The semiconductor device includes a second transistor having a second threshold voltage greater than the first threshold voltage, and including second channels, second source/drain layers connected to opposite sidewalls of the second channels, and a second gate structure surrounding the second channels and including a second gate insulation pattern, a second threshold voltage control pattern, and a second workfunction metal pattern sequentially stacked. A thickness of the second threshold voltage control pattern is equal to or less than a thickness of the first threshold voltage control pattern.


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