The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Feb. 04, 2021
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Ying-Chung Chen, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 33/52 (2010.01); H01L 33/00 (2010.01); H01L 31/16 (2006.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 31/02002 (2013.01); H01L 31/16 (2013.01); H01L 31/18 (2013.01); H01L 33/005 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract
An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a first die, a bumping structure, and a second die. The first die is on a carrier. The bumping structure is over the first die. The bumping structure includes a light-transmitting portion and a light-blocking portion embedded in the light-transmitting portion. The second die is electrically connected to the carrier. The light-blocking portion of the bumping structure is free from covering the second die.