The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Sep. 21, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Yann Mignot, Slingerlands, NY (US);

James J. Kelly, Schenectady, NY (US);

Muthumanickam Sankarapandian, Niskayuna, NY (US);

Yongan Xu, San Jose, CA (US);

Hsueh-Chung Chen, Madison, WI (US);

Daniel J. Vincent, Albany, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/5283 (2013.01); H01L 21/0276 (2013.01);
Abstract

A semiconductor device includes a stack structure having at least first, second and third interconnect levels. Each interconnect level has a patterned metal conductor including a first metallic material. A via spans the second and third interconnect levels and electrically couples with the patterned metal conductor of the first interconnect level. At least a segment of the super via includes a second metallic material different from the first metallic material.


Find Patent Forward Citations

Loading…