The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Jul. 01, 2020
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/12 (2006.01); H01B 1/22 (2006.01); H05K 1/09 (2006.01); C08L 33/02 (2006.01); C08L 25/08 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
H01B 1/122 (2013.01); C08L 25/08 (2013.01); C08L 33/02 (2013.01); H01B 1/22 (2013.01); H05K 1/09 (2013.01); C08K 3/08 (2013.01); C08K 2003/0806 (2013.01);
Abstract
The conductive wiring material composition includes (A) a polymer compound having a repeating unit 'a' which has a structure selected from an ammonium salt, a lithium salt, a sodium salt, a potassium salt and a silver salt of any of fluorosulfonic acid, fluorosulfonimide and fluorosulfonamide and (B) metal powder, wherein the component (B) is contained with an amount exceeding 50 parts by mass based on 100 parts by mass of a solid content of the conductive wiring material composition excluding the component (B).