The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Nov. 09, 2018
Applicant:
Namics Corporation, Niigata, JP;
Inventors:
Makiko Sato, Niigata, JP;
Osamu Suzuki, Niigata, JP;
Naoki Obata, Niigata, JP;
Yoshinobu Kokaji, Niigata, JP;
Assignee:
NAMICS CORPORATION, Niigata, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/06 (2006.01); C23C 18/18 (2006.01); C23C 22/52 (2006.01); C25D 5/34 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C25D 7/06 (2013.01); C23C 18/18 (2013.01); C23C 22/52 (2013.01); C25D 5/34 (2013.01); H05K 1/09 (2013.01); H05K 3/384 (2013.01); H05K 3/385 (2013.01);
Abstract
[Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.