The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2023
Filed:
Jan. 14, 2022
Lintec Corporation, Tokyo, JP;
Masanori Yamagishi, Phoenix, AZ (US);
Akinori Sato, Saitama, JP;
LINTEC Corporation, Tokyo, JP;
Abstract
A curable resin film of the present invention forms a first protective film () by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface () of a semiconductor wafer () having a plurality of bumps () with an average peak height (h1) of 50 to 400 μm, an average diameter of 60 to 500 μm, and an average pitch of 100 to 800 μm, heating the attached curable resin film at 100° C. to 200° C. for 0.5 to 3 hours, and curing the heated curable resin film, and when longitudinal sections thereof are observed by a scanning electron microscope, a ratio (h3/h1) of an average thickness (h3) of the first protective film () at a center position between the bumps () to an average peak height (h1) of the bumps (), and a ratio (h2/h1) of an average thickness (h2) of the first protective film () at a position being in contact with the plurality of bumps () to the average peak height (h1) satisfy a relationship represented by the following expression of [{(h2/h1)−(h3/h1)}≤0.1].