The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2023

Filed:

Dec. 23, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Meng-Hsueh Wu, Hsinchu, TW;

Fang Yu Kuo, Hsinchu, TW;

Kai Yu Liu, Hsinchu, TW;

Yu-Chun Wu, Hsinchu, TW;

Jao Huang, Jiayi, TW;

Wei-Yi Chen, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 9/08 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B08B 9/0813 (2013.01); H01L 21/67051 (2013.01);
Abstract

An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.


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