The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Mar. 31, 2021
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Hitoshi Fujioka, Ann Arbor, MI (US);

Shailesh N. Joshi, Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20936 (2013.01); H02M 7/003 (2013.01); H05K 1/0209 (2013.01); H05K 1/116 (2013.01); H05K 3/341 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A system includes a power device unit coupled to a substrate. An upper cooling assembly is thermally coupled to an upper side of the substrate. A lower cooling assembly is thermally coupled to a lower side of the substrate. A gate driver unit is coupled to the upper cooling assembly. At least one upper via is formed through the upper cooling electrically coupling the gate driver unit to the power device unit. A capacitor unit is coupled to the lower cooling assembly. At least one lower via formed through the lower cooling assembly electrically coupling the capacitor unit to the power device unit.


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