The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Sep. 21, 2015
Applicant:

Danfoss Silicon Power Gmbh, Flensburg, DE;

Inventors:

Ronald Eisele, Surendorf, DE;

Holger Ulrich, Eisendorf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); B22F 3/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B22F 3/14 (2013.01); B23K 1/0016 (2013.01); H01L 24/32 (2013.01); H01L 24/75 (2013.01); H05K 3/32 (2013.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); H01L 24/29 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29295 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/755 (2013.01); H01L 2224/7511 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83095 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83204 (2013.01); H01L 2224/83911 (2013.01); H01L 2224/83948 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1157 (2013.01);
Abstract

Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.


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