The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Sep. 10, 2021
International Business Machines Corporation, Armonk, NY (US);
Douglas J. Malone, Pleasant Valley, NY (US);
Andreas H. A. Arp, Nufringen, DE;
Franklin M. Baez, Fishkill, NY (US);
Daniel M. Dreps, Georgetown, TX (US);
Jason Lee Frankel, Wappingers Falls, NY (US);
Chad Andrew Marquart, Austin, TX (US);
Ching Lung Tong, Highland Mills, NY (US);
Lily Jielu Zhang, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A two-chip die module with minimal chip-to-chip clock skew is provided. The two-chip die module includes a common substrate, first and second chips operably disposed on the common substrate to be communicative in parallel with one another and a single phase lock loop (PLL). The PLL is disposed within one of the first and second chips to provide a source for a common clock signal for the first and second chips. PLL signals of the PLL to the first and second chips are nearly equal and clock sample signals of the first and second chips are nearly equal.