The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Sep. 30, 2021
Applicant:

Fujimi Incorporated, Aichi, JP;

Inventors:

Hiroki Kon, Aichi, JP;

Naoto Noguchi, Aichi, JP;

Assignee:

FUJIMI INCORPORATED, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/321 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/304 (2013.01); H01L 21/3212 (2013.01); H01L 21/30625 (2013.01);
Abstract

An object of the present invention is to provide a polishing composition that can achieve both a high polishing removal rate and high surface quality. According to the present invention, provided is a polishing composition for polishing a material to be polished. The polishing composition contains sodium metavanadate, hydrogen peroxide, and silica abrasive. The content C1 of sodium metavanadate is 0.7% to 3.5% by weight, the content C2 of hydrogen peroxide is 0.3% to 3% by weight, and the content C3 of the silica abrasive is 12% to 50% by weight.


Find Patent Forward Citations

Kon, Hiroki. (2023). Polishing composition (U.S. Patent No. 11773292). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11773292

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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