The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Mar. 11, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Sivapackia Ganapathiappan, Los Altos, CA (US);

Boyi Fu, San Jose, CA (US);

Ashwin Chockalingam, Santa Clara, CA (US);

Daniel Redfield, Morgan Hill, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Mahendra C. Orilall, Downingtown, PA (US);

Hou T. Ng, Campbell, CA (US);

Jason G. Fung, Santa Clara, CA (US);

Mayu Yamamura, San Mateo, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01);
Abstract

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.


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