The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Apr. 05, 2019
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Yuki Inoue, Tokyo, JP;
Takamasa Suzuki, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 37/04 (2012.01); B24B 49/04 (2006.01); B24B 41/06 (2012.01); B24B 37/30 (2012.01); H01L 21/306 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 37/04 (2013.01); B24B 37/30 (2013.01); B24B 41/061 (2013.01); B24B 49/04 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01);
Abstract
A polishing apparatus includes a holding table having a holding surface that holds a wafer, a polishing unit in which a polishing pad having an opening at the center of a polishing surface that polishes the wafer is mounted to a spindle and is rotated, a slurry supply unit that supplies slurry to the polishing surface of the polishing pad, and an air supply unit that shuts an upper end of a penetrating path penetrating through the axial center of rotation of the polishing pad and the spindle and supplies air into the penetrating path.