The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Dec. 28, 2018
Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Hiroyoshi Kawasaki, Tokyo, JP;

Masato Shiratori, Tochigi, JP;

Hiroyuki Yamasaki, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/362 (2006.01); C08L 93/04 (2006.01); C08K 5/092 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); B23K 35/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/362 (2013.01); B23K 35/262 (2013.01); B23K 35/3613 (2013.01); C08K 5/092 (2013.01); C08L 93/04 (2013.01); C22C 13/00 (2013.01);
Abstract

Provided are a resin composition and a soldering flux. The resin composition includes at least one acid and rosin. The acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by hydrogenating a trimer acid which is a reaction product of oleic acid and linoleic acid. A weight ratio of the at least one acid to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin. The soldering flux is obtained by diluting the resin composition with a solvent.


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