The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Mar. 06, 2023
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Shunsuke Koga, Tokyo, JP;
Tomoki Sasaki, Tokyo, JP;
Yoshie Tachibana, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Assignee:
SENJU METAL INDUSTRY CO., LTD., Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); C22C 13/00 (2006.01); C22C 19/03 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0233 (2013.01); B23K 35/3033 (2013.01); C22C 13/00 (2013.01); C22C 19/03 (2013.01);
Abstract
Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder () having a metal structure including a first phase () that is a continuous phase and a second phase () dispersed in the first phase (), the first phase () contains Sn, the second phase () is formed of an alloy containing Ni and Fe, and a grain boundary () of a metal is present in the first phase ().