The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2023

Filed:

Oct. 28, 2020
Applicant:

Sang-yun Lee, Hillsboro, OR (US);

Inventor:

Sang-Yun Lee, Hillsboro, OR (US);

Assignee:

BESANG, INC., Hillsboro, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H10B 43/27 (2023.01); H01L 29/423 (2006.01); H01L 25/18 (2023.01); H01L 29/40 (2006.01); H01L 29/06 (2006.01); H10B 12/00 (2023.01); H10B 43/35 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H01L 29/4234 (2013.01); H01L 25/18 (2013.01); H01L 29/0649 (2013.01); H01L 29/401 (2013.01); H01L 29/66666 (2013.01); H01L 29/66833 (2013.01); H01L 29/7827 (2013.01); H01L 29/7926 (2013.01); H10B 12/05 (2023.02); H10B 12/31 (2023.02); H10B 12/50 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H10B 43/40 (2023.02);
Abstract

Structures and methods that facilitate the formation of gate contacts for vertical transistors constructed with semiconductor pillars and spacer-like gates are disclosed. In a first embodiment, a gate contact rests on an extended gate region, a piece of a gate film, patterned at a side of a vertical transistor at the bottom of the gate. In a second embodiment, an extended gate region is patterned on top of one or more vertical transistors, resulting in a modified transistor structure. In a third embodiment, a gate contact rests on a top surface of a gate merged between two closely spaced vertical transistors. Optional methods and the resultant intermediate structures are included in the first two embodiments in order to overcome the related topography and ease the photolithography. The third embodiment includes alternatives for isolating the gate contact from the semiconductor pillars or for isolating the affected semiconductor pillars from the substrate.


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