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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11769728 B1

PDFFull Text
Date of Patent:
Sep. 26, 2023

Filed:

Jan. 27, 2021

Backside power distribution network semiconductor package and method of manufacturing the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Saehan Park, Clifton Park, NY (US);

Hoonseok Seo, Niskayuna, NY (US);

Jeonghyuk Yim, Halfmoon, NY (US);

Ki-il Kim, Clifton Park, NY (US);

Gil Hwan Son, Clifton Park, NY (US);

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Jonathan Han

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 21/822 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 21/76898 (2013.01); H01L 21/8221 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 27/0694 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05157 (2013.01); H01L 2224/05176 (2013.01);
Abstract

Provided is a semiconductor architecture including a carrier substrate, a landing pad included in the carrier substrate, a first semiconductor device provided on a first surface of the carrier substrate, the first semiconductor device including a first component provided on the landing pad, and a second semiconductor device provided on a second surface of the carrier substrate, a second component protruding from the second semiconductor device being provided on the landing pad.

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