The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Jul. 16, 2021
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chi-Hui Lai, Taichung, TW;
Yang-Che Chen, Hsin-Chu, TW;
Chen-Hua Lin, Yunlin County, TW;
Victor Chiang Liang, Hsinchu, TW;
Chwen-Ming Liu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A method of testing a semiconductor package is provided. The method includes forming a first metallization layer, wherein the first metallization layer includes a first conductive pad electrically connected to a charge measurement unit and a charge receiving unit; performing a first test against the charge measurement unit through the first conductive pad to determine whether breakdown occurs in the charge measurement unit; and in response to determining that no breakdown occurs in the charge measurement unit, forming a second dielectric layer over the first metallization layer, wherein a portion of the first conductive pad is exposed from the second dielectric layer.