The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2023
Filed:
Mar. 20, 2019
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Takaaki Matsumoto, Tokyo, JP;
Tomohiro Iwano, Tokyo, JP;
Tomoyasu Hasegawa, Tokyo, JP;
Tomomi Kukita, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/304 (2006.01); H01L 21/3105 (2006.01); B24B 37/04 (2012.01); C09K 13/06 (2006.01); B24B 1/00 (2006.01); C09G 1/06 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); C09G 1/04 (2006.01); C09G 1/00 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 3/14 (2013.01); C09K 3/1409 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/06 (2013.01); H01L 21/304 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/31055 (2013.01); H01L 21/3212 (2013.01);
Abstract
A polishing liquid containing: abrasive grains; a hydroxy acid; a polymer compound having at least one selected from the group consisting of a hydroxyl group and an amide group; and a liquid medium, in which a zeta potential of the abrasive grains is positive, and a weight average molecular weight of the polymer compound is 3000 or more.