The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Jan. 31, 2020
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Takehiro Yonezawa, Naka, JP;

Satoko Higano, Naka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/00 (2006.01); H01C 1/142 (2006.01); H01C 17/00 (2006.01); H01C 17/065 (2006.01);
U.S. Cl.
CPC ...
H01C 7/008 (2013.01); H01C 1/142 (2013.01); H01C 17/006 (2013.01); H01C 17/06553 (2013.01);
Abstract

The present invention is provided with a base electrode layer forming step of forming a base electrode layer on both surfaces of a thermistor wafer formed of a thermistor material, a chip forming step of obtaining a thermistor chip with a base electrode layer by cutting the thermistor wafer to form chips, a protective film forming step of forming a protective film formed of an oxide on an entire surface of the thermistor chip with a base electrode layer, a cover electrode layer forming step of forming a cover electrode layer by applying and sintering a conductive paste on an end surface of the thermistor chip with a base electrode layer, and a conduction heat treatment step of performing a heat treatment such that the base electrode layer and the cover electrode layer are electrically conductive, in which the electrode portion is formed.


Find Patent Forward Citations

Loading…