The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Jul. 24, 2019
Applicant:

Invensas Bonding Technologies, Inc., San Jose, CA (US);

Inventor:

Qin-Yi Tong, Durham, NC (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/04 (2019.01); B81C 1/00 (2006.01); H01L 21/3105 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B32B 7/04 (2013.01); B81C 1/00357 (2013.01); H01L 21/3105 (2013.01); H01L 21/76251 (2013.01); H01L 24/26 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); B32B 2250/04 (2013.01); B81C 2201/019 (2013.01); B81C 2203/019 (2013.01); B81C 2203/0118 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/08059 (2013.01); H01L 2224/29186 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/81894 (2013.01); H01L 2224/81895 (2013.01); H01L 2224/8319 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83894 (2013.01); H01L 2224/83896 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/9212 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01016 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/351 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24355 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/31504 (2015.04); Y10T 428/31678 (2015.04);
Abstract

A method of bonding includes using a bonding layer having a fluorinated oxide. Fluorine may be introduced into the bonding layer by exposure to a fluorine-containing solution, vapor or gas or by implantation. The bonding layer may also be formed using a method where fluorine is introduced into the layer during its formation. The surface of the bonding layer is terminated with a desired species, preferably an NHspecies. This may be accomplished by exposing the bonding layer to an NHOH solution. High bonding strength is obtained at room temperature. The method may also include bonding two bonding layers together and creating a fluorine distribution having a peak in the vicinity of the interface between the bonding layers. One of the bonding layers may include two oxide layers formed on each other. The fluorine concentration may also have a second peak at the interface between the two oxide layers.


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