The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Jun. 15, 2021
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Gaspard Hiblot, Leuven, BE;

Geert Van der Plas, Leuven, BE;

Assignee:

IMEC VZW, Leuven, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/8238 (2006.01); H01L 23/48 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7849 (2013.01); H01L 21/823807 (2013.01); H01L 21/823871 (2013.01); H01L 23/481 (2013.01); H01L 27/0924 (2013.01);
Abstract

Example embodiments relate to methods for inducing stress in semiconductor devices. One method includes a method for producing a first semiconductor device and a second semiconductor device configured to conduct current through the controlled density of charge carriers in a channel area. The charge carriers of the first semiconductor device have opposite polarity to the charge carriers of the second semiconductor device. The method includes producing a stress relaxed buffer (SRD) layer. The back side of the SRB layer is positioned on a substrate. The method also includes producing a semiconductor layer on the front side of the SRB layer. Additionally, the method includes producing the first semiconductor device and the second semiconductor device on the semiconductor layer, removing the substrate, thinning the SRB layer, producing a cavity in the SRB layer, and filling the cavity with a material to create a stress compensation area.


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