The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Apr. 23, 2023
Applicant:

Monolithic 3d Inc., Klamath Falls, OR (US);

Inventors:

Zvi Or-Bach, Haifa, IL;

Brian Cronquist, Klamath Falls, OR (US);

Deepak Sekar, Sunnyvale, CA (US);

Assignee:

Monolithic 3D Inc., Klamath Falls, OR (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 21/74 (2006.01);
U.S. Cl.
CPC ...
H01L 21/743 (2013.01);
Abstract

A 3D device includes a first level including a first single crystal layer with control circuitry, where the control circuitry includes first single crystal transistors; a first metal layer atop first single crystal layer; a second metal layer atop the first metal layer; a third metal layer atop the second metal layer; second level (includes a plurality of second transistors) atop the third metal layer; a fourth metal layer disposed above the one second level; a fifth metal layer atop the fourth metal layer, where the second level includes at least one first oxide layer overlaid by a transistor layer and then overlaid by a second oxide layer; a global power distribution grid, which includes the fifth metal layer; a local power distribution grid including at least one second transistor, the thickness of the fifth metal layer is at least 50% greater than the thickness of the second metal layer.


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