The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Oct. 18, 2019
Kabushiki Kaisha Nihon Micronics, Tokyo, JP;
Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;
Toshinori Omori, Tokyo, JP;
Kazuya Goto, Tokyo, JP;
Yasuaki Osanai, Tokyo, JP;
Takashi Akiniwa, Tokyo, JP;
Takeki Sugisawa, Tokyo, JP;
Takeshi Kondo, Kanagawa, JP;
Shintaro Abe, The Cavendish, SG;
Maki Watanabe, Kanagawa, JP;
KABUSHIKI KAISHA NIHON MICRONICS, Tokyo, JP;
TANAKA KIKINZOKU KOGYO K.K., Tokyo, JP;
Abstract
An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined. A probe substrate according to the present disclosure includes: a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected, a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering, in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left and the organic component parts and/or the voids included in the metal layer formed by sintering have 5 to 80 area percent in a vertical cross section of the metal layer formed by sintering.