The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Aug. 18, 2021
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Kyoung Yeon Lee, Incheon, KR;

Tae Yong Lee, Gyeonggi-do, KR;

Doo Soub Shin, Incheon, KR;

Seon A Lee, Incheon, KR;

Woo Bin Jung, Seoul, KR;

Ji Yeon Ryu, Incheon, KR;

Jin Young Khim, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2023.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01Q 1/50 (2006.01); H01Q 21/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/16 (2013.01); H01Q 1/50 (2013.01); H01Q 21/24 (2013.01); H01L 2221/68359 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/08237 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/80006 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.


Find Patent Forward Citations

Loading…