The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Feb. 19, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

Takashi Ishihara, Tokyo, JP;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G11C 5/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); G11C 5/14 (2013.01); H01L 24/05 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05554 (2013.01);
Abstract

Layouts for pads and conductive lines of memory devices are disclosed. A memory device may include memory cells and conductive lines arranged above memory cells. The conductive lines may extend from substantially a first side of the memory device to substantially a second side of the memory device. Each of the conductive lines may be electrically coupled to a bond pad, a first probe pad and a second probe pad. The bond pad may be positioned at or near the first side and be configured to receive power. The first probe pad may be positioned at or near the first side and be configured to be electrically coupled to a probe. The second probe pad may be positioned at or near the second side. Associated systems and methods are also disclosed.


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