The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Oct. 23, 2020
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Arthur Pun, Raleigh, NC (US);

Basim Noori, San Jose, CA (US);

Assignee:

Wolfspeed, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/495 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/047 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/4817 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/047 (2013.01); H01L 23/293 (2013.01); H01L 23/296 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/66 (2013.01); H01L 2223/6683 (2013.01);
Abstract

A method of packaging a radio frequency (RF) transistor device includes attaching one or more electronic devices to a carrier substrate, applying an encapsulant over at least one of the one or more electronic devices, and providing a protective structure on the carrier substrate over the one or more electronic devices. A packaged RF transistor device includes a carrier substrate, one or more electronic devices attached to the carrier substrate, an encapsulant material over at least one of the one or more electronic devices and extending onto the carrier substrate, and a protective structure on the carrier substrate over the one or more electronic devices and the encapsulant material.


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