The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Jun. 07, 2022
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Ji Hoon Oh, Gyeonggi-do, KR;

Dong Hyun Bang, Incheon, KR;

Soo Jin Shin, Gyeonggi-do, KR;

Young Ik Kwon, Taichung, TW;

Tae Kyeong Hwang, Seoul, KR;

Min Jae Lee, Chandler, AZ (US);

Min Jae Kong, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/66 (2013.01); H01L 25/105 (2013.01); H01Q 1/2283 (2013.01);
Abstract

In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.


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