The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Aug. 14, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Hidetoshi Ishibashi, Tokyo, JP;

Yoshitaka Kimura, Tokyo, JP;

Minoru Egusa, Tokyo, JP;

Nobuhiro Asaji, Tokyo, JP;

Kazunari Teshigawara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/58 (2011.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01R 12/70 (2011.01); H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/049 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 23/049 (2013.01); H01L 23/3114 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 25/162 (2013.01); H01R 12/585 (2013.01); H01R 12/7064 (2013.01); H01L 2224/48091 (2013.01);
Abstract

A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.


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