The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Sep. 14, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chan-Sik Kwon, Asan-si, KR;

Jin Duck Park, Asan-si, KR;

Jin Wook Jang, Asan-si, KR;

Ji-Yeon Han, Asan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/11 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
G01R 31/11 (2013.01); H01L 23/528 (2013.01); H01L 23/562 (2013.01); H01L 23/585 (2013.01); H01L 24/06 (2013.01); H01L 2224/06131 (2013.01);
Abstract

A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.


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