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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11735550 B1

PDFFull Text
Date of Patent:
Aug. 22, 2023

Filed:

Dec. 20, 2021

Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Ching-Sheng Chu, Baoshan Township, TW;

Chern-Yow Hsu, Chu-Bei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Eschweiler & Potashnik, LLC

Primary Examiner:

Karen Kusumakar

Assistant Examiner:

Adam S Bowen

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/76834 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/08 (2013.01); H01L 24/11 (2013.01); H01L 2924/01007 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/37001 (2013.01);
Abstract

Various embodiments of the present disclosure are directed towards a semiconductor structure including a bond bump disposed on an upper surface of an upper conductive structure. The upper conductive structure overlies a substrate. A buffer layer is disposed along the upper surface of the upper conductive structure. The bond bump comprises a sidewall having a straight sidewall segment overlying a curved sidewall segment.

Find Patent Forward Citations

Chu, Ching-Sheng. (2023). Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion (U.S. Patent No. 11735550). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11735550

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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