The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Sep. 20, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Osamu Miyahara, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 29/00 (2006.01); H01L 21/67 (2006.01); B24B 37/005 (2012.01); B24B 49/00 (2012.01); H01L 21/687 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
B24B 29/005 (2013.01); B24B 37/005 (2013.01); B24B 49/006 (2013.01); H01L 21/30625 (2013.01); H01L 21/67017 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01); H01L 21/67219 (2013.01); H01L 21/67253 (2013.01); H01L 21/68785 (2013.01);
Abstract

A substrate processing method includes polishing a target surface of a substrate to be polished by moving a polishing brush in a horizontal direction while pressing the polishing brush against the polishing target surface of the substrate which rotates in a horizontal posture around a vertical axis. The polishing is performed while varying a rotation speed of the substrate and a moving speed of the polishing brush such that the rotation speed of the substrate decreases stepwise or continuously and the moving speed of the polishing brush in a radial direction of the substrate decreases stepwise or continuously as a distance from a center of rotation of the substrate measured in the radial direction of the substrate to a center of the polishing brush increases.


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