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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11731224 B1

PDFFull Text
Date of Patent:
Aug. 22, 2023

Filed:

Oct. 08, 2021

Systems and methods of applying materials to components

Applicant:

Laird Technologies, Inc., Chesterfield, MO (US);

Inventors:

Tsang-I Tsai, Xinbei, TW;

Yi-Shen Lin, New Taipei, TW;

Min-Wei Hsu, New Taipei, TW;

Chen-Xi Yu, Shen Zhen, CN;

Assignee:

Laird Technologies, Inc., Chesterfield, MO (US);

Attorneys:

Harness, Dickey & Pierce, P.L.C.

Anthony G. Fussner

Primary Examiner:

Linda L Gray

Int. Cl.
CPC ...
B23P 19/10 (2006.01); B65H 35/00 (2006.01); F28F 3/02 (2006.01); B65C 9/18 (2006.01); H01L 21/48 (2006.01); B65H 18/10 (2006.01);
U.S. Cl.
CPC ...
B23P 19/10 (2013.01); B65H 18/103 (2013.01); B65H 35/008 (2013.01); B65H 35/0013 (2013.01); F28F 3/02 (2013.01); H01L 21/4882 (2013.01); B23P 2700/09 (2013.01); B23P 2700/10 (2013.01); B65H 2301/51538 (2013.01);
Abstract

Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.

Find Patent Forward Citations

Tsai, Tsang-I. (2023). Systems and methods of applying materials to components (U.S. Patent No. 11731224). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11731224

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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