The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Feb. 17, 2022
Applicant:

Ibiden Co., Ltd., Gifu, JP;

Inventors:

Akinori Yoshida, Ogaki, JP;

Katsuhiko Tanno, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 3/34 (2013.01); H05K 3/4007 (2013.01); H05K 3/4605 (2013.01);
Abstract

A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including conductor pads, an underlayer formed on one of the conductor pads and including a metal different from a metal of the conductor layer, a solder resist layer formed on the base layer such that the solder resist layer is covering the conductor layer and has openings exposing the conductor pads, and a bump formed directly on a first conductor pad of the conductor pads and including a base plating layer formed in a first opening of the openings and a top plating layer formed on the base plating layer such that a metal of the base plating layer is same as the metal of the conductor layer. The conductor pads include a second conductor pad such that the second conductor pad is the one of the conductor pads having the underlayer.


Find Patent Forward Citations

Yoshida, Akinori. (2023). Printed wiring board and method for manufacturing the same (U.S. Patent No. 11729911). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11729911

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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