The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
May. 11, 2021
Sandisk Technologies Llc, Addison, TX (US);
Shiqian Shao, Fremont, CA (US);
Fumiaki Toyama, Cupertino, CA (US);
Peter Rabkin, Cupertino, CA (US);
SANDISK TECHNOLOGIES LLC, Addison, TX (US);
Abstract
A semiconductor structure includes a bonded assembly of a first semiconductor die including first metal bonding pads and a second semiconductor die including second metal bonding pads, and a capacitor structure including a first electrode, a second electrode, and a node dielectric. The first electrode includes first bonded pairs of metal bonding pads. The second electrode includes second bonded pairs of metal bonding pads. The node dielectric includes portions dielectric material layers laterally surrounding the metal bonding pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile