The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Sep. 23, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Brandon C. Marin, Chandler, AZ (US);
Frank Truong, Gilbert, AZ (US);
Shivasubramanian Balasubramanian, Gilbert, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/20 (2006.01); H01F 27/28 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 1/20 (2013.01); H01F 17/0013 (2013.01); H01F 17/0033 (2013.01); H01F 27/2804 (2013.01); H01L 23/49838 (2013.01); H01L 23/645 (2013.01); H01L 24/16 (2013.01); H01F 2027/2809 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19103 (2013.01);
Abstract
A magnetic material may be fabricated with a plurality of magnetic filler particles dispersed within a carrier material, wherein at last one of the magnetic filler particles may comprise a ferromagnetic core coated with an inert material to form a shell surrounding the ferromagnetic core. Such a coating may allow for the use of ferromagnetic materials for forming embedded inductors in package substrates without the risk of being incompatible with fabrication processes used to form these package substrates.