The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Sep. 25, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Debendra Das Sharma, Saratoga, CA (US);

Michelle C. Jen, Mountain View, CA (US);

Prahladachar Jayaprakash Bharadwaj, Bangalore, IN;

Bruce Tennant, Hillsboro, OR (US);

Mahesh Wagh, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01); G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4027 (2013.01); G06F 13/4282 (2013.01); G06F 2213/0026 (2013.01);
Abstract

Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.


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