The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Apr. 12, 2022
Sunghwan Kim, Hanam-si, KR;
Ho-young Kim, Seoul, KR;
Seok Heo, Hwaseong-si, KR;
Dongwook Kim, Seoul, KR;
Sungjin Kim, Suwon-si, KR;
Chaehung Lim, Hwaseong-si, KR;
Jaekyung Park, Seoul, KR;
Jae Hong Lee, Seongnam-si, KR;
Junyoung Lee, Yongin-si, KR;
Sunghwan Kim, Hanam-si, KR;
Ho-Young Kim, Seoul, KR;
Seok Heo, Hwaseong-si, KR;
Dongwook Kim, Seoul, KR;
Sungjin Kim, Suwon-si, KR;
Chaehung Lim, Hwaseong-si, KR;
Jaekyung Park, Seoul, KR;
Jae Hong Lee, Seongnam-si, KR;
Junyoung Lee, Yongin-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Seoul National University R&DB Foundation, Seoul, KR;
Abstract
In a method of coating a photoresist, the photoresist may be provided to an upper surface of a rotating wafer. A hovering solution may be injected to an edge portion of the photoresist under a condition that the hovering solution may be hovered with respect to the edge portion of the photoresist with an air layer being interposed between the hovering solution and the edge portion of the photoresist to limit and/or prevent a bead of the photoresist from being formed on an edge portion of the upper surface of the wafer. Thus, the photoresist having a uniform thickness may be coated on the upper surface of the wafer to improve a yield of a semiconductor device by increasing an effective area of the edge portion of the wafer.