The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2023

Filed:

Jul. 02, 2018
Applicants:

SK Innovation Co., Ltd., Seoul, KR;

SK Global Chemical Co., Ltd., Seoul, KR;

Inventors:

Minho Jung, Daejeon, KR;

Namkyu Lee, Daejeon, KR;

Jinsu Ham, Daejeon, KR;

Kyunphyo Lee, Daejeon, KR;

Kwangkuk Lee, Daejeon, KR;

Kwangho Lee, Daejeon, KR;

Hyeryoung Lee, Daejeon, KR;

Sooyoung Hwang, Daejeon, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/11 (2006.01); C08G 61/02 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
C08G 61/02 (2013.01); G03F 7/0045 (2013.01); G03F 7/0048 (2013.01); G03F 7/11 (2013.01); H01L 21/027 (2013.01); C08G 2261/1422 (2013.01); C08G 2261/1644 (2013.01); C08G 2261/314 (2013.01);
Abstract

The present invention relates to a polymer having a novel structure used in a process for manufacturing a semiconductor and a display; an underlayer film composition for a process for manufacturing a semiconductor and a display, including the same; and a method for manufacturing a semiconductor element by using the same. The novel polymer of the present invention has both optimized etch selection ratio and planarization properties and excellent heat resistance, and thus the underlayer film composition including the same can be used as a hard mask in a semiconductor multilayer lithography process.


Find Patent Forward Citations

Loading…