The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Oct. 06, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Shams U. Arifeen, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/14517 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract
Semiconductor devices having mechanical pillar structures, such as angled pillars, that are rectangular and oriented with respect to a semiconductor die to reduce bending stress and in-plane shear stress at a semiconductor die to which the angled pillars are attached, and associated systems and methods, are disclosed herein. The semiconductor device can include angled pillars coupled to the semiconductor die and to a package substrate. The angled pillars can be configured such that they are oriented relative to a direction of local stress to increase section modulus.