The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2023

Filed:

Apr. 27, 2021
Applicant:

Spts Technologies Limited, Newport, GB;

Inventors:

Scott Haymore, Newport, GB;

Amit Rastogi, Newport, GB;

Rhonda Hyndman, Newport, GB;

Steve Burgess, Newport, GB;

Ian Moncrieff, Wotton-Under-Edge, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/50 (2006.01); C23C 14/34 (2006.01); C23C 14/35 (2006.01); C23C 14/54 (2006.01); C23C 14/06 (2006.01); H01J 37/34 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 14/505 (2013.01); C23C 14/345 (2013.01); C23C 14/3407 (2013.01); C23C 14/3485 (2013.01); C23C 14/35 (2013.01); C23C 14/50 (2013.01); C23C 14/541 (2013.01); H01J 37/32715 (2013.01); H01J 37/3405 (2013.01); H01J 37/3411 (2013.01); H01J 37/3467 (2013.01); C23C 14/0617 (2013.01); C23C 14/0641 (2013.01); H01J 37/3426 (2013.01);
Abstract

A method of depositing a film on a substrate is provided. The method includes positioning the substrate on a substrate support in a chamber and depositing the film on the substrate using a DC magnetron sputtering process in which an electrical bias signal causes ions to bombard the substrate. The substrate support includes a central region surrounded by an edge region, the central region being raised with respect to the edge region, and the substrate is positioned on the central region so that a portion of the substrate overlays the edge region and is spaced apart therefrom.


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