The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
Dec. 14, 2021
Tokyo Ohka Kogyo Co., Ltd., Kanagawa, JP;
Tsuyoshi Kurosawa, Kanagawa, JP;
TOKYO OHKA KOGYO CO., LTD., Kanagawa, JP;
Abstract
Provided are a curable composition that exhibits favorable adhesiveness without heating at elevated temperatures, and a method for producing a joined structure using the curable composition. As a curable composition for use in forming one or more bonding layers bonding the two or more adherends, in which at least one of the two or more adherends includes a low heat-resistance material, a curable composition that contains an epoxy resin including a structural unit of a specific structure including an epoxy group, and yields a cured product exhibiting a water contact angle of 40° or more and 50° or less by heating at 80° C. or higher and 100° C. or lower and an exposure is used.