The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Jul. 06, 2021
Applicant:
Agc Inc., Tokyo, JP;
Inventors:
Yu Hanawa, Tokyo, JP;
Shigeki Sawamura, Tokyo, JP;
Shuhei Nomura, Tokyo, JP;
Kazutaka Ono, Tokyo, JP;
Nobuhiko Takeshita, Tokyo, JP;
Keisuke Hanashima, Tokyo, JP;
Assignee:
AGC Inc., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/06 (2006.01); H01L 23/15 (2006.01); C03C 27/04 (2006.01); C03C 3/085 (2006.01); C03C 3/087 (2006.01); C03C 3/091 (2006.01); C03C 3/093 (2006.01); B32B 1/00 (2006.01); B32B 9/00 (2006.01); C03C 17/22 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); B32B 1/00 (2013.01); B32B 9/005 (2013.01); B32B 17/06 (2013.01); C03C 3/085 (2013.01); C03C 3/087 (2013.01); C03C 3/091 (2013.01); C03C 3/093 (2013.01); C03C 17/22 (2013.01); C03C 27/04 (2013.01); H01L 23/13 (2013.01); B32B 2307/30 (2013.01); B32B 2457/14 (2013.01);
Abstract
The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.