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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11715672 B1

PDFFull Text
Date of Patent:
Aug. 01, 2023

Filed:

Nov. 18, 2021

Endpoint detection for chemical mechanical polishing based on spectrometry

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Dominic J. Benvegnu, La Honda, CA (US);

Jeffrey Drue David, San Jose, CA (US);

Boguslaw A. Swedek, Morgan Hill, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Sylvia MacArthur

Int. Cl.
CPC ...
H01L 21/66 (2006.01); B24B 37/013 (2012.01); B24B 37/20 (2012.01); B24B 49/08 (2006.01); B24B 49/12 (2006.01); B24D 7/14 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); B24B 37/013 (2013.01); B24B 37/205 (2013.01); B24B 49/08 (2013.01); B24B 49/12 (2013.01); B24D 7/14 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/31055 (2013.01); H01L 21/3212 (2013.01); H01L 21/67075 (2013.01); H01L 21/67092 (2013.01); H01L 21/67253 (2013.01);
Abstract

A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.

Find Patent Forward Citations

Benvegnu, Dominic. (2023). Endpoint detection for chemical mechanical polishing based on spectrometry (U.S. Patent No. 11715672). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11715672

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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